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Substrate Manufacturing Services - Thick Film Substrate
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Substrate Manufacturing Services - Thick Film Substrate (01)
Substrate Manufacturing Services - Thick Film Substrate (01)
Substrate Manufacturing Services - Thick Film Substrate
Thick Film Substrate
Applications: Automotive, Sensors
TAG: Substrate Manufacturing Services, Thick Film Substrate,
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Substrate Manufacturing Services - Thin Film Substrate(DPC)
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
Assembly Packaging - COB
COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Substrate Manufacturing Services - Thick Film Substrate Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan Substrate Manufacturing Services - Thick Film Substrate supplier and manufacturer in Substrate Manufacturing Services - Thick Film Substrate industry since 1975. In Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality Substrate Manufacturing Services - Thick Film Substrate OEM and ODM Service. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903