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Backend Technology & Others - Wafer Grinding & Dicing
Wafer-11
Backend Technology & Others - Wafer Grinding & Dicing (11)
Backend Technology & Others - Wafer Grinding & Dicing
Wafer Grinding & Dicing:
- Grinding: 6", 8", 12" wafers available.
- Minimum thickness of 10 mils for 12" wafers, 6 mils for 8", 6 mils for 6" wafers.
TAG: Backend Technology, Wafer Grinding & Dicing,
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COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Backend Technology & Others - Wafer Grinding & Dicing Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan Backend Technology & Others - Wafer Grinding & Dicing supplier and manufacturer in Backend Technology & Others - Wafer Grinding & Dicing industry since 1975. In Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality Backend Technology & Others - Wafer Grinding & Dicing OEM and ODM Service. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903