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Backend Technology & Others - Dicing Saw
DicingSaw-12
Backend Technology & Others - Dicing Saw (12)
Backend Technology & Others - Dicing Saw
Dicing Saw
Up to 12" available.
TAG: Backend Technology, Dicing Saw,
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Substrate Manufacturing Services - Thin Film Substrate(DPC)
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
Assembly Packaging - COB
COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Backend Technology & Others - Dicing Saw Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan Backend Technology & Others - Dicing Saw supplier and manufacturer in Backend Technology & Others - Dicing Saw industry since 1975. In Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality Backend Technology & Others - Dicing Saw OEM and ODM Service. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903