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Backend Technology & Others - Backend Operations
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Backend Technology & Others - Backend Operations (10)
Backend Technology & Others - Backend Operations (10)
Backend Technology & Others - Backend Operations
Backend Operations:
- Overmold, liquid encapsulation, glob top, metal can, plastic lid, hermetic ceramic lid or metal lids, Temex CSP are all available.
- Auto packing into JEDEC trays, tubes and tape & reel are all available.
- Yag laser, green laser and pad printing for marking.
- Both LGA and BGA are available.
TAG: Backend Technology, Backend Operations,
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COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Backend Technology & Others - Backend Operations Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan Backend Technology & Others - Backend Operations supplier and manufacturer in Backend Technology & Others - Backend Operations industry since 1975. In Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality Backend Technology & Others - Backend Operations OEM and ODM Service. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903