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Assembly Packaging - GGI Flip Chip
GGI-09
Assembly Packaging - GGI Flip Chip (09)
Assembly Packaging - GGI Flip Chip (09)
Assembly Packaging - GGI Flip Chip
GGI Flip Chip (Gold Gold interconnections):
- Maximum die size: 5mm x 5mm
- Maximum number of bumps: 20
- Minimum bump pitch: 150 micons
- Major applications in power LED, SAW, TCXO and MEMS.
TAG: Assembly Packaging, GGI Flip Chip,
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Tong Hsing Assembly Packaging - GGI Flip Chip Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan Assembly Packaging - GGI Flip Chip supplier and manufacturer in Assembly Packaging - GGI Flip Chip industry since 1975. In Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality Assembly Packaging - GGI Flip Chip OEM and ODM Service. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903