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Assembly Packaging - C4 Flip Chip
C4-08
Assembly Packaging - C4 Flip Chip (08)
Assembly Packaging - C4 Flip Chip (08)
Assembly Packaging - C4 Flip Chip
C4 Flip Chip (controlled Collapse Chip Connection):
- Eutectic, lead free and high lead solder bumps are available.
- Underfill available.
- Minimun pitch: 200 microns
TAG: Assembly Packaging, C4 Flip Chip,
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Tong Hsing Assembly Packaging - C4 Flip Chip Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan Assembly Packaging - C4 Flip Chip supplier and manufacturer in Assembly Packaging - C4 Flip Chip industry since 1975. In Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality Assembly Packaging - C4 Flip Chip OEM and ODM Service. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903