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OEM Capacity
Tong Hsing - OEM Capacity
Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film/Thin Film Substrate Fabrication:
* SiP Packaging for WLAN, UWB, and PAN
* MEMS Packaging
* CMOS Image Sensor Packaging
* Reconstruction Wafer
* Chip Probing and Final Test
* PCB assembly with SMT and/or COB Processes
* Automotive Hybrids
* Thin Film on Alumina and AlN
* Thick Film on Alumina
Years of Experience : Over 30 Years
Main Customers :
- AEI
- Advanced Bionics
- Anadigics
- DDC
- Delphi
- National Semiconductor
- Sensata
- SiGe
- Skyworks
- TI
Excellent Productivity
With many years of experience in thick film printing and flying together with newly developed thin film DPC, Tong Hsing offers very high performance and economy substrate technology idea for many applications including RF microwave, high brightness LED, MEMS, solar cell, fuel cell and power modules.
DPC
AOI
Flying Probe
RF Microwave
High Brightness LED
MEMS
Solar Cell
Fuel Cell
Power Modules
Promotion
Substrate Manufacturing Services - Thin Film Substrate(DPC)
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
Assembly Packaging - COB
COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market since 1975. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903