DBC offered from Tong Hsing is intended to replace traditional DBC in many applications. The advantages of Tong Hsing offered DBC compared to traditional DBC include: more robust bonding between the substrate and copper plating, ability to offer substrates with a wide range of copper thicknesses, excellent electrical and thermal contact between copper plated vias and surface metallization and lower temperature processing which means much reduced residual stress in the copper metallization layers.

If you are interested in knowing more about the general design guidelines, please contact us directly.

Thin Film DPC Substrate
1. High Power LED
2. Microwave (Wireless Communication)
3. Semiconductor Process Equipment
4. Solar Cell
5. Hybrid Electric Vehicles