Assembly Packaging - GGI Flip Chip
GGI Flip Chip (Gold Gold interconnections):
- Maximum die size: 5mm x 5mm
- Maximum number of bumps: 20
- Minimum bump pitch: 150 micons
- Major applications in power LED, SAW, TCXO and MEMS.
Assembly Packaging - C4 Flip Chip
C4 Flip Chip (controlled Collapse Chip Connection):
- Eutectic, lead free and high lead solder bumps are available.
- Underfill available.
- Minimun pitch: 200 microns
Assembly Packaging - COB
COB:
- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils.
- Ball bonds, wedge-wedge and ribbon bonds.
- Minimum bond pitch at 3.5 mils.
- Die bond accuracy down to 10 micron.
- Capable of handling six different dice.
- Wafer mapping as well as dice are available.
Assembly Packaging - SMT
SMT:
- Largest 0201 component user in Taiwan.
- Over 100 million chips placed every month.
- Over 99.7% yield.
- Volume experience in placing 0.5mm pitch CSP.
- Lead free & RoHS compliant.
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Substrate Manufacturing Services - Thin Film Substrate(DPC)
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
Assembly Packaging - COB
COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Assembly Packaging Services Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan Assembly Packaging Services supplier and manufacturer in Assembly Packaging Services industry since 1975. In Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality Assembly Packaging Services OEM and ODM Service. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903