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Tong Hsing’s organization has four main components, Taipei Headquarters, the Taipei Manufacturing Site, Chung Li Manufacturing Site and Philippines Manufacturing Site. In addition, our Arizona office in the U.S. facilitates communication by providing factory support and business development activities.
Tong Hsing also has a network of experienced, knowledgeable representatives in key markets around the world. Production facilities in Taipei, Chun-Li and the Philippines utilize identity materials, processes, equipment and control procedures after being developed and qualified in Taiwan. This dual source provides us with special capabilities for both large scale and smaller markets to satisfy each customer’s needs.
Taipei Manufacturing Site
Address: Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: + 886-2-26790122 (ext.1901 / 1903)
FAX: 886-2-26791211 (ext.1901 / 1903)
Email: ken_wu@mail.theil.com.tw; sophia_chen@mail.theil.com.tw
Tong Hsing Electronics (Phils), Inc.
Plant I address:
116 Excellence Avenue, corner Competence Drive, Carmelray Industrial Business Park I, Canlubang, Calamba, Laguna, 4028 Philippines
Plant II address:
103 Prosperity Avenue, Carmelray International Business Park I, Canlubang, Calamba, Laguna, 4028 Philippines
To visit our Philippine facility, please go to http://www.tonghsing.ph/
Tong Hsing USA Office - Arizona
Address: 1842 W. Grant Road #102, Tucson AZ 85745, U.S.A.
Tel: +1-520-791-7825
FAX: +1-520-791-7938
Contact Person: Gail Langley
EMAIL: gail@thusa.com
Tong Hsing Electronic Ind., Ltd. (ChungLi Plant)
Address: 8F, No.27, Ji-Lin Rd., Chung-Li Industrial Park, Tao-Yuan Hsien, Taiwan
Tel: +886-3-433-5998
FAX: +886-3-433-5995
Promotion
Substrate Manufacturing Services - Thin Film Substrate(DPC)
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
Assembly Packaging - COB
COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market since 1975. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903